HID Global To Showcase Advanced eID Solutions at AAMVA -- Security Today

HID Global To Showcase Advanced eID Solutions at AAMVA

Aug 16, 2012

HID Global, a provider of solutions for the delivery of secure identity, will showcase its comprehensive portfolio of secure government identification technologies and issuance systems at the American Association of Motor Vehicles Administration International Conference and Exhibition in Charlotte, North Carolina, August 20 - 22.

HID Global will showcase its broad range of industry-leading offerings for solutions providers to the U.S. driver’s license market in booth 207. The company will feature its advanced eID card technologies and card issuance equipment, including inlays, prelaminates, smart card chips and optical media, and its unique anti-crack technology, designed to ensure the durability of eID and transport cards incorporating IC chips, as well as the industry-leading FARGO® HDP8500 industrial printer/encoder for high duty cycle distributed card issuance.

“As a member of AAMVA, HID Global is excited to present our innovative offerings for this critical area of the eID industry and interact with so many influencers in the North America driver’s license market,” said Kevin McKenna, vice president of sales for Government ID Solutions, Americas, with HID Global. “We look forward to showcasing the unique breadth and depth of technologies and expertise we can offer to solution providers as they compete for ever more sophisticated projects.”

In recent years, a growing trend has emerged for U.S. state driver’s license programs to specify higher-value, longer-lasting and more secure cards – such as laser-engraved polycarbonate cards – as well as enhanced credentials incorporating UHF RFID inlays, IC chips and high durability retransfer print material. This mirrors the accelerating popularity among governments and organizations worldwide of advanced credential technologies and issuance systems for a wide variety of card projects.

The demand for enhanced government ID card solutions and advancements in materials science has driven important progress in card construction, giving rise to more sophisticated solutions that better meet the complex quest for program security, reliability, efficiency and durability.

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