HID Global Partners with NXP

  • Aug 07, 2015

HID Global, announced an ultra-thin Polycarbonate (PC) ePrelaminate inlay for electronic ID (e-ID) cards that is more than 30 percent thinner than alternatives.  The new offering is the first HID Global inlay to use its patented HID direct bonding platform technology, which is available for high frequency (HF) systems. NXP Semiconductors is HID Global’s first qualified partner supplying IC chips for this product.

HID Global’s new inlay takes advantage of its proven process of directly bonding chips to wire-embedded air-coil antennae for low-frequency animal ID and automotive applications, without the bulk of added modules. The company has successfully leveraged its direct bonding technology for HF applications, enabling manufacturers to develop the smallest HF formats available in the market while delivering uncompromised performance. By using this method in its new ultra-thin inlays, HID Global is providing smart cards with a durable and reliable connection between the card’s intelligence – the IC chip – and its antennae.

“With this new ultra-thin inlay, we continue to extend the unique capabilities of our government solutions while offering smart card manufacturers around the world the ability to extend the range of products they can offer their customers,” said Rob Haslam, vice president of Government ID Solutions for HID Global. “This is also representative of the strong collaboration between HID Global and NXP, who share the mutual goal of assuring the best inlay quality and reliability for secure, long-lasting smart cards.”

In addition, the thinner inlay offers e-ID and smart card manufacturers more flexibility in card construction. The narrow dimensions of HID Global’s ultra-thin inlays – 200 microns instead of the typical 350 microns – provide manufacturers with room to add more security features on both sides of an e-ID card during construction, while still complying with international ISO thickness standards.

“This is an important step in our shared goal of offering smart card manufacturers the thinnest, most durable, reliable and flexible inlay solutions possible for today’s space-restricted high-frequency smart card solutions,” said Ulrich Huewels, senior vice president and general manager, Secure Identification Solutions, NXP Semiconductors. “Working with an innovative company like HID Global ensures our market leading secure microcontrollers are available in versatile form factors for use in a wide range of smart card applications.”

NXP Semiconductors successfully qualified its SmartMX2 P60D080 secure microcontroller IC for inclusion in HID Global’s new ultra-thin PC e-Prelaminate inlay that adapts well to the HID direct bonding technology. Additionally, the companies partnered to create a special Megabump design to elevate the benefits of the direct bonding process (patent pending) and offer customers a solution that can be applied to many ID card applications.

Featured

  • Video Surveillance Trends to Watch

    With more organizations adding newer capabilities to their surveillance systems, it’s always important to remember the “basics” of system configuration and deployment, as well as the topline benefits of continually emerging technologies like AI and the cloud. Read Now

  • New Report Reveals Top Trends Transforming Access Controller Technology

    Mercury Security, a provider in access control hardware and open platform solutions, has published its Trends in Access Controllers Report, based on a survey of over 450 security professionals across North America and Europe. The findings highlight the controller’s vital role in a physical access control system (PACS), where the device not only enforces access policies but also connects with readers to verify user credentials—ranging from ID badges to biometrics and mobile identities. With 72% of respondents identifying the controller as a critical or important factor in PACS design, the report underscores how the choice of controller platform has become a strategic decision for today’s security leaders. Read Now

  • Overwhelming Majority of CISOs Anticipate Surge in Cyber Attacks Over the Next Three Years

    An overwhelming 98% of chief information security officers (CISOs) expect a surge in cyber attacks over the next three years as organizations face an increasingly complex and artificial intelligence (AI)-driven digital threat landscape. This is according to new research conducted among 300 CISOs, chief information officers (CIOs), and senior IT professionals by CSC1, the leading provider of enterprise-class domain and domain name system (DNS) security. Read Now

  • ASIS International Introduces New ANSI-Approved Investigations Standard

    • Guard Services

  • Cloud Security Alliance Brings AI-Assisted Auditing to Cloud Computing

    The Cloud Security Alliance (CSA), the world’s leading organization dedicated to defining standards, certifications, and best practices to help ensure a secure cloud computing environment, today introduced an innovative addition to its suite of Security, Trust, Assurance and Risk (STAR) Registry assessments with the launch of Valid-AI-ted, an AI-powered, automated validation system. The new tool provides an automated quality check of assurance information of STAR Level 1 self-assessments using state-of-the-art LLM technology. Read Now

Most   Popular

New Products

  • Camden CM-221 Series Switches

    Camden CM-221 Series Switches

    Camden Door Controls is pleased to announce that, in response to soaring customer demand, it has expanded its range of ValueWave™ no-touch switches to include a narrow (slimline) version with manual override. This override button is designed to provide additional assurance that the request to exit switch will open a door, even if the no-touch sensor fails to operate. This new slimline switch also features a heavy gauge stainless steel faceplate, a red/green illuminated light ring, and is IP65 rated, making it ideal for indoor or outdoor use as part of an automatic door or access control system. ValueWave™ no-touch switches are designed for easy installation and trouble-free service in high traffic applications. In addition to this narrow version, the CM-221 & CM-222 Series switches are available in a range of other models with single and double gang heavy-gauge stainless steel faceplates and include illuminated light rings.

  • Unified VMS

    AxxonSoft introduces version 2.0 of the Axxon One VMS. The new release features integrations with various physical security systems, making Axxon One a unified VMS. Other enhancements include new AI video analytics and intelligent search functions, hardened cybersecurity, usability and performance improvements, and expanded cloud capabilities

  • Connect ONE’s powerful cloud-hosted management platform provides the means to tailor lockdowns and emergency mass notifications throughout a facility – while simultaneously alerting occupants to hazards or next steps, like evacuation.

    Connect ONE®

    Connect ONE’s powerful cloud-hosted management platform provides the means to tailor lockdowns and emergency mass notifications throughout a facility – while simultaneously alerting occupants to hazards or next steps, like evacuation.