HID Global Unveils Wafer-thin UHF High Temperature Label

  • Feb 25, 2015

HID Global announced that its Identification Technologies division has launched its new High Temperature Label portfolio of wafer-thin UHF RFID tags that endure harsh industrial environments. The company’s High Temperature Labels were originally designed for the automotive industry, where manufacturers use them to identify and track each vehicle both during assembly and throughout its life on the road. Lifetime traceability of parts and components yields more accurate and efficient records which can help automakers expedite service in the event of a recall.

“Our automotive customers need durable UHF tags that can withstand years of exposure to high temperatures, flames, chemicals, pressure and torsion,” said Richard Aufreiter, director of product management, Identification Technologies with HID Global. “The new High Temperature Label portfolio of tags delivers uncompromised performance in these harsh conditions.”

HID Global’s High Temperature Labels deliver consistent, reliable readability during the rigors of auto manufacturing including welding operations, autoclaves, immersion in anti-corrosive electrolyte baths, cycles of paint layer application, and drying ovens that exceed 400° F (200° C).

Resistance to extreme physical, mechanical and thermal environments makes the High Temperature Label portfolio of tags ideal for all types of manufacturing logistics and inventory control operations.  They are especially useful for tracking both work-in-progress and finished goods for industrial tools, medical trays, heavy equipment, car and aerospace components, cargo containers, and even blade and rack servers.

The tags may be laser engraved with additional visual information such as logos, bar codes or text.

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